Subjects : Flexible packaging
| Type | Year | Title | Cited | Download |
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| Journal | 2016 | Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 | 4 | 원문 |
| Conference | 2015 | Electrically Conductive Paste with Copper for Flexible Packaging Application Eom Yong Sung International Symposium on Microelectronics and Packaging (ISMP) 2015, pp.144-144 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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