Subjects : circuit modelling
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2014 | Bottom‐inlet‐type micro‐electro‐mechanical system acoustic sensors based on two polyimide/amorphous‐Si sacrificial layers Jaewoo Lee IET Micro & Nano Letters, v.9, no.12, pp.845-849 | 1 | 원문 |
| Journal | 2012 | Thin MEMS microphone based on package-integrated fabrication process Jaewoo Lee Electronics Letters, v.48, no.14, pp.866-867 | 5 | 원문 |
| Journal | 2002 | Equivalent Circuit Modelling of Spiral Defected Ground Structure for Microstrip Line 김철수 Electronics Letters, v.38, no.19, pp.1109-1110 | 91 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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