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Conference
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2024 |
Efficiency Comparison of Boost Converters based on Forward Characteristics and Reverse Recovery of 1200V class SiC SBD Devices
Won Jong Il 대한전자공학회 학술 대회 (하계) 2024, pp.2557-2558 |
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Journal
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2022 |
Switching and Heat-Dissipation Performance Analysis of an LTCC-Based Leadless Surface Mount Package
Jung Dong Yun Journal of Semiconductor Technology and Science, v.22, no.1, pp.1-9 |
1 |
원문
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Conference
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2020 |
Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors
Jung Dong Yun International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606 |
4 |
원문
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Conference
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2019 |
SiC SBD power semiconductor SMD package for switching loss reduction
Jung Dong Yun 한국 반도체 학술 대회 (KCS) 2019, pp.617-617 |
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