Subjects : packaging applications
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2016 | Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 | 4 | 원문 |
| Conference | 2015 | Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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