Subject

Subjects : i-line

  • Articles (4)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2022 Direct patterning of colloidal quantum dots with adaptable dual-ligand surface   임재민  Nature Nanotechnology, v.17, no.9, pp.952-958 138 원문
Journal 2022 Direct patterning of colloidal quantum dots with adaptable dual-ligand surface   함동효  Nature Nanotechnology, v.17, no.9, pp.952-958 138 원문
Journal 2022 Direct patterning of colloidal quantum dots with adaptable dual-ligand surface   김혁준  Nature Nanotechnology, v.17, no.9, pp.952-958 138 원문
Conference 2002 The effect of via size on fine pitch and high density solder bumps for wafer level packaging   Ju Chull Won  Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 원문
특허 검색결과
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연구보고서 검색결과
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