Journal
|
2022 |
Direct patterning of colloidal quantum dots with adaptable dual-ligand surface
임재민 Nature Nanotechnology, v.17, no.9, pp.952-958 |
138 |
원문
|
Journal
|
2022 |
Direct patterning of colloidal quantum dots with adaptable dual-ligand surface
함동효 Nature Nanotechnology, v.17, no.9, pp.952-958 |
138 |
원문
|
Journal
|
2022 |
Direct patterning of colloidal quantum dots with adaptable dual-ligand surface
김혁준 Nature Nanotechnology, v.17, no.9, pp.952-958 |
138 |
원문
|
Conference
|
2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
|
원문
|