Subjects : Sn-Ag
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2014 | Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications Haksun Lee IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 | 15 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2019 | 솔더 페이스트 | KOREA | KIPRIS | |
| Registered | 2019 | 솔더 페이스트 | KOREA | KIPRIS |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||