Subjects : Packaging solution
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 | 0 | 원문 |
| Journal | 2004 | Passive alignment method of polymer PLC devices by using a hot embossing technique Jin Tae Kim IEEE Photonics Technology Letters, v.16, no.7, pp.1664-1666 | 39 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| No search results. | |||||
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||