Subjects : Fine pitch bump
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2012 | Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 | 2 | 원문 |
| Journal | 2007 | A Flip-Chip-Packaged InP HBT Transimpedance Amplifier for 40-Gb/s Optical Link Applications Ju Chull Won Journal of the Korean Physical Society, v.50, no.3, pp.862-865 | 2 | 원문 |
| Conference | 2003 | A limiting amplifier module using wafer level package for 10Gbps optical transmission system Ju Chull Won Electronic Components and Technology Conference (ECTC) 2003, pp.1572-1575 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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