Subjects : Organic substrate
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2013 | Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers Choi Kwang-Seong International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 | 0 | |
| Journal | 2013 | Novel Bumping Process for Solder on Pad Technology Choi Kwang-Seong ETRI Journal, v.35, no.2, pp.340-343 | 23 | 원문 |
| Conference | 2009 | Improvement of TFT Properties by Hydrogen Defect Passivation for High Performance Flexible Electronics Device Application Musarrat Hasan Trends in Nanotechnology Conference (TNT) 2009, pp.1-2 |
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| Type | Year | Research Project | Primary Investigator | Download |
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