Subjects : HPC Application
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2025 | Heterogeneous Integration through 2.5D Silicon Interposers for Next-Generation AI and HPC Applications 김덕기 International Symposium on Microelectronics and Packaging (ISMP) 2025, pp.1-1 | ||
| Conference | 2021 | OS noise Analysis on Azalea-unikernel Seung-Jun Cha International Conference on Advanced Communications Technology (ICACT) 2021, pp.1-4 | 2 | 원문 |
| Conference | 2019 | Space Sharing Effects on Manycore Systems Seung-Jun Cha International Conference on Advanced Communications Technology (ICACT) 2019, pp.710-713 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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