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Conference
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2016 |
BCD Technology with an integrated Trench Gate MOSFET for Smart Power IC
Won Jong Il International Conference on Electronics, Information and Communication (ICEIC) 2016, pp.745-746 |
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Conference
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2013 |
A BCD Process Technology in Smart Power IC with Integrated Trench Gate MOSFET
International Symposium on the Physics of Semiconductors and Applications (ISPSA) 2013, pp.1-1 |
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Journal
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2003 |
An InGaP-GaAs HBT MMIC smart power amplifier for W-CDMA mobile handsets
Kim Joon Hyung IEEE Journal of Solid-State Circuits, v.38, no.6, pp.905-910 |
53 |
원문
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