|
Journal
|
2025 |
Suppression of Ag dewetting and sinterability improvement of submicron Ag-coated Cu particles as fillers in sintering paste by surface modification with stearic acid
김영정 Transactions of Nonferrous Metals Society of China (English Edition), v.35, no.6, pp.2008-2020 |
1 |
원문
|
|
Conference
|
2017 |
Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
0 |
원문
|
|
Conference
|
2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
|
|