Subjects : bonding mechanism
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2013 | Novel Interconnection Technology for Flex-on-Glass (FOG) Applications Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 | ||
| Journal | 2010 | Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder Eom Yong Sung ETRI Journal, v.32, no.3, pp.414-421 | 52 | 원문 |
| Journal | 2008 | Electrical and Mechanical Characterization of an Anisotropic Conductive Adhesive with a Low Melting Point Solder Eom Yong Sung Microelectronic Engineering, v.85, no.11, pp.2202-2206 | 32 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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