Subjects : Cu pillar bump
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2015 | Novel Low-Volume Solder-on-Pad Process for Fine Pitch Cu Pillar Bump Interconnection Bae Hyun-Cheol 한국마이크로전자 및 패키징학회지, v.22, no.2, pp.55-59 | 원문 | |
| Conference | 2013 | Novel Low-Volume Solder-on-Pad for Fine-Pitch Cu Pillar Bump Bae Hyun-Cheol European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-4 |
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| Type | Year | Research Project | Primary Investigator | Download |
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