Subjects : Lead-free solder powder
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2020 | Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 | 원문 | |
| Conference | 2012 | Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 | 2 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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