Subjects : Low parasitic inductance
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2022 | Switching and Heat-Dissipation Performance Analysis of an LTCC-Based Leadless Surface Mount Package Jung Dong Yun Journal of Semiconductor Technology and Science, v.22, no.1, pp.1-9 | 1 | 원문 |
| Conference | 2016 | Multi-layer Substrate Based Power Semiconductor Package for Low Parasitic Inductance and High Heat Transfer Jung Dong Yun Asia-Pacific Workshop on Fundamentals and Applications of Advanced Semiconductor Devices (AWAD) 2016, pp.283-285 |
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