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Conference
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2019 |
A Study of Overflowed Epoxy Resin in a Butt-coupling with FAB and EML Mounted on PCB for a Compact Optic Design of Ethernet 100G/400G CWDM4 Data Center Application
Lee Jyung Chan Asia Communications and Photonics Conference (ACP) 2019, pp.1-3 |
3 |
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Journal
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2018 |
High performance flexible piezoelectric pressure sensor based on CNTs-doped 0–3 ceramic-epoxy nanocomposites
Hye Jin Kim Materials & Design, v.151, pp.133-140 |
132 |
원문
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Conference
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2017 |
Solvent-free Fluxing Underfill Film for Electrical Interconnection
Keonsoo Jang European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 |
3 |
원문
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Conference
|
2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
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