Subjects : packaging method
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2016 | Fully Passive-Alignment Pluggable Compact Parallel Optical Interconnection Modules based on a Direct-Butt-Coupling Structure for Fiber-Optic Applications Lim Kwon-Seob Optical Engineering, v.55, no.2, pp.1-9 | 5 | 원문 |
| Conference | 2015 | A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module Lim Kwon-Seob Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| Registered | 2020 | 세라믹 적층형 반도체 패키지 및 패키징 방법 | KOREA | KIPRIS |
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
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