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Journal
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2025 |
Suppression of Ag dewetting and sinterability improvement of submicron Ag-coated Cu particles as fillers in sintering paste by surface modification with stearic acid
김영정 Transactions of Nonferrous Metals Society of China (English Edition), v.35, no.6, pp.2008-2020 |
1 |
원문
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Journal
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2019 |
Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications
Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 |
11 |
원문
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Journal
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2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
원문
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|
Conference
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2015 |
Isotropic Conductive Paste Based on Epoxy with Ag Coated Cu and SAC305 Solder
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2015, pp.1-5 |
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