패밀리특허 검색결과
Status	Patent	Country	KIPRIS
Registered	반도체 패키지의 제조 방법	KOREA
Registered	반도체 패키지의 제조 방법	KOREA
Registered	SEMICONDUCTOR PACKAGE WITH INTERMETALLIC-COMPOUND SOLDER-JOINT COMPRISING SOLDER, UBM, AND REDUCING LAYER MATERIALS	UNITED STATES
Registered	SEMICONDUCTOR PACKAGE WITH INTERMETALLIC-COMPOUND SOLDER-JOINT COMPRISING SOLDER, UBM, AND REDUCING LAYER MATERIALS	UNITED STATES