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Registered SEMICONDUCTOR PACKAGE WITH INTERMETALLIC-COMPOUND SOLDER-JOINT COMPRISING SOLDER, UBM, AND REDUCING LAYER MATERIALS

Inventors
Application No.
17/399754 (2021.08.11)
Publication No.
US2022/0102603 A1 (2022.03.31)
Registration No.
12206056 (2025.01.21)
Country
UNITED STATES
Project Code
20JB3800, Development of multi-functional core materials of transfer and bonding process for micro LEDs, Choi Kwang-Seong
20JB2300, Development of electroplating materials for semiconductor high-density modules, Eom Yong Sung
KSP Keywords
Semiconductor package, layer materials
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered 반도체 패키지의 제조 방법 KOREA KIPRIS
Registered 반도체 패키지의 제조 방법 KOREA KIPRIS
Registered SEMICONDUCTOR PACKAGE WITH INTERMETALLIC-COMPOUND SOLDER-JOINT COMPRISING SOLDER, UBM, AND REDUCING LAYER MATERIALS UNITED STATES
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