BROWSE
Detail
Registered COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME
- Inventors
- Eom Yong Sung, Moon Jong Tae, Jang Keonsoo, Oh Sangwon
- Application No.
- 12476925 (2009.06.02)
- Publication No.
- 20100006625 (2010.01.14)
- Registration No.
- 8420722 (2013.04.16)
- Country
- UNITED STATES
- Project Code
- 08MB3300, 차세대 ACF 소재 및 공정기술 개발, Eom Yong Sung
- Abstract
- Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.
- KSP Keywords
- Low melting, Low melting point, Polymer resin, Solder bump, anisotropic conductive adhesive, conductive adhesive, curing agent, flip chip, melting point
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 조성물, 및 이를 이용한 솔더 범프 형성방법 및 플립칩 형성방법 | KOREA | KIPRIS |
| Registered | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | |
| Registered | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES | |
| Registered | COMPOSITION AND METHODS OF FORMING SOLDER BUMP AND FLIP CHIP USING THE SAME | UNITED STATES |