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Registered HIGH-SPEED OPTICAL INTERCONNECTION DEVICE

고속 광배선 소자
이미지 확대
Inventors
Lee Sang-Heung, Hae Cheon Kim, Hokyun Ahn, Eun Soo Nam, Kim Dong-Young, Mun Jae Kyoung, Woojin Chang, Dong Min Kang, Ji Hong Gu, Jong-Won Lim
Application No.
12421130 (2009.04.09)
Publication No.
20100133551 (2010.06.03)
Registration No.
8058658 (2011.11.15)
Country
UNITED STATES
Project Code
08ZB1300, SiGe-Based Quantum Channel Nano-Device Technology, Lee Sang-Heung
Abstract
Provided is a high-speed optical interconnection device. The high-speed optical interconnection device includes a first semiconductor chip, light emitters, optical detectors, and a second semiconductor chip, which are disposed on a silicon-on-insulator (SOI) substrate. The light emitters receive electrical signals from the first semiconductor chip to output optical signals. The optical detectors detect the optical signals to convert the optical signals into electrical signals. The second semiconductor chip receives the electrical signals converted by the optical detectors.
KSP Keywords
Electrical signal, High Speed, Optical detector, Optical interconnection, Semiconductor chip, Silicon On Insulator(SOI), Silicon-on-insulator (SOI) substrate, light emitter