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Registered HIGH-SPEED OPTICAL INTERCONNECTION DEVICE
- Inventors
- Lee Sang-Heung, Hae Cheon Kim, Mun Jae Kyoung, Hokyun Ahn, Woojin Chang, Kim Dong-Young, Dong Min Kang, Eun Soo Nam, Ji Hong Gu, Jong-Won Lim
- Application No.
- 12421130 (2009.04.09)
- Publication No.
- 20100133551 (2010.06.03)
- Registration No.
- 8058658 (2011.11.15)
- Country
- UNITED STATES
- Project Code
- 08ZB1300, SiGe-Based Quantum Channel Nano-Device Technology, Lee Sang-Heung
- Abstract
- Provided is a high-speed optical interconnection device. The high-speed optical interconnection device includes a first semiconductor chip, light emitters, optical detectors, and a second semiconductor chip, which are disposed on a silicon-on-insulator (SOI) substrate. The light emitters receive electrical signals from the first semiconductor chip to output optical signals. The optical detectors detect the optical signals to convert the optical signals into electrical signals. The second semiconductor chip receives the electrical signals converted by the optical detectors.
- KSP Keywords
- Electrical signal, High Speed, Optical detector, Optical interconnection, Semiconductor chip, Silicon On Insulator(SOI), Silicon-on-insulator (SOI) substrate, light emitter