상세정보
등록 플립 칩 본딩 방법 및 그의 구조
- 출원번호
- 12761715 (2010.04.16)
- 공개번호
- 20110089577 (2011.04.21)
- 등록번호
- 8211745 (2012.07.03)
- 출원국
- 미국
- 협약과제
- 09MB4300, 도전 및 접합 기능을 갖는 하이브리드형 언더필 소재 개발, 엄용성
- 초록
- Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.
- KSP 제안 키워드
- Manufacturing yield, Solder bump, flip chip