BROWSE
Detail
Registered METHOD AND STRUCTURE FOR BONDING FLIP CHIP
- Inventors
- Eom Yong Sung, Moon Jong Tae, Choi Kwang-Seong
- Application No.
- 12761715 (2010.04.16)
- Publication No.
- 20110089577 (2011.04.21)
- Registration No.
- 8211745 (2012.07.03)
- Country
- UNITED STATES
- Project Code
- 09MB4300, Hybrid underfill material for an electrical interconnection and high adhesion strength, Eom Yong Sung
- Abstract
- Provided is a method and structure for bonding a flip chip while increasing the manufacturing yield. In the method, solder bumps are formed on first electrodes and/or second electrodes disposed on first and second substrates, respectively. In addition, the first and second electrodes are arranged to face each other with a second resin including spacer balls being disposed between the first and second substrates. In addition, while flowing the second resin, the first and second substrates are pressed until the distance between the first and second substrates is decreased smaller than diameter of the spacer balls so as to connect the solder bumps between the first and second electrodes.