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Registered METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLIP CHIP BONDING SEMICONDUCTOR USING THE SAME
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METHOD OF FORMING SOLDER ON PAD ON FINE PITCH PCB AND METHOD OF FLIP CHIP BONDING SEMICONDUCTOR USING THE SAME
- Inventors
- Eom Yong Sung, Noh Jung Hyun, Choi Kwang-Seong
- Application No.
- 13760350 (2013.02.06)
- Publication No.
- 20130334291 (2013.12.19)
- Registration No.
- 8794502 (2014.08.05)
- Country
- UNITED STATES
- Project Code
- 11MB4500, Development of advanced ultra thin MCP PCB Moudle & Embedded PCB SIP Moudle, Eom Yong Sung
- Abstract
- Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
- KSP Keywords
- Fine pitch, Flip-chip bonding, Polymer resin, Residual polymer, Solder On Pad, Solder bump, Solder mask, chip bonding, flip chip, melting point, semiconductor device
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 미세 피치 ＰＣＢ 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법 | KOREA | KIPRIS |