등록
미세 피치 PCB 기판에 솔더 범프 형성 방법 및 이를 이용한 반도체 소자의 플립 칩 본딩 방법
- 발명자
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엄용성, 노정현, 최광성
- 출원번호
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13760350 (2013.02.06)
- 공개번호
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20130334291 (2013.12.19)
- 등록번호
- 8794502 (2014.08.05)
- 출원국
- 미국
- 협약과제
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11MB4500, 차세대 초박형 MCP 인쇄회로 기판모듈/SiP용 임베디드 PCB 모듈,
엄용성
- 초록
- Disclosed are a method of forming a solder on pad on a fine pitch PCB and a method of flip chip bonding a semiconductor device using the same. The method of forming a solder on pad on a fine pitch PCB includes: applying a solder bump maker (SBM) paste with a predetermined thickness to an entire surface of a PCB including a metal pad and a solder mask; heating the SBM paste at a temperature higher than a melting point of solder contained in the SBM paste and then cooling the SBM paste to form a solder on pad; and washing a residual polymer resin and residual solder particles of the SBM paste by using a solvent.
- KSP 제안 키워드
- Fine pitch, Flip-chip bonding, Polymer resin, Residual polymer, Solder On Pad, Solder bump, Solder mask, chip bonding, flip chip, melting point, semiconductor device
- 패밀리
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