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Detail
Registered METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE
- Inventors
- Choi Kwang-Seong, Keonsoo Jang, Eom Yong Sung, Bae Hyun-Cheol, Moon Seok-Hwan, Jung Leeseul, 주니어
- Application No.
- 16115060 (2018.08.28)
- Publication No.
- 20190067235 (2019.02.28)
- Registration No.
- 10636761 (2020.04.28)
- Country
- UNITED STATES
- Project Code
- 17PB1300, Development of ultra precision stack bonding equipment for different packages using variable-area of laser, Choi Kwang-Seong
- Abstract
- Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 반도체 패키지의 제조 방법 | KOREA | KIPRIS |