ETRI-Knowledge Sharing Plaform

KOREAN
특허 검색
Status Country
Year ~ Keyword

Detail

Registered METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE

레이저를 이용한 반도체 접합 공정
이미지 확대
Inventors
Choi Kwang-Seong, Keonsoo Jang, Eom Yong Sung, Bae Hyun-Cheol, Moon Seok-Hwan, Jung Leeseul, 주니어
Application No.
16115060 (2018.08.28)
Publication No.
20190067235 (2019.02.28)
Registration No.
10636761 (2020.04.28)
Country
UNITED STATES
Project Code
17PB1300, Development of ultra precision stack bonding equipment for different packages using variable-area of laser, Choi Kwang-Seong
Abstract
Provided is a method of fabricating a semiconductor package. The method includes preparing a package substrate having a substrate pad, and mounting a semiconductor chip on the substrate pad. Mounting the semiconductor chip includes forming a resin layer containing a solder and reducing agent granules having a first capsule layer, between a chip pad of the semiconductor chip and the substrate pad, and bonding the chip pad to the substrate pad using laser irradiated to the semiconductor chip.
Family
 
패밀리 특허 목록
Status Patent Country KIPRIS
Registered Method of fabricating a semiconductor package KOREA KIPRIS