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Registered SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Inventors
- Hyung Seok Lee, Hokyun Ahn, Jang Yoo Jin, Hae Cheon Kim, Hyung Sup Yoon, Mun Jae Kyoung, Jong-Won Lim, Kim Seong-Il, Woojin Chang, Lee Sang-Heung, Shin Min Jeong, Sungjae Chang, Kyu Jun Cho, Bae Sung-Bum, Kim Zin-Sig, Kim Dong-Young, Kim Jeong Jin, Min Byoung-Gue, Jongmin Lee, Dong Min Kang, Jae Won Do, Ji Hong Gu, Jung Hyunwook
- Application No.
- 16134286 (2018.09.18)
- Publication No.
- 20190096782 (2019.03.28)
- Registration No.
- 10651107 (2020.05.12)
- Country
- UNITED STATES
- Project Code
- 17HB2400, Development of High Efficiency GaN-based Key Components and Modules for Base and Mobile Stations, Jong-Won Lim
- Abstract
- Provided are a semiconductor device and a method for fabricating the same. The semiconductor device includes a heat dissipation plate including a first region and a second region, a first element disposed on the heat dissipation plate in the first region, and a second element disposed on the heat dissipation plate in the second region. The first element includes a first substrate, the second element includes a second substrate, the first substrate includes a material different from a material of the second substrate, the first substrate contacts the heat dissipation plate, and the second element is bonded to the heat dissipation plate in a flip-chip bonding manner.
- KSP Keywords
- Flip-chip(FC), Flip-chip bonding, Heat dissipation, chip bonding, semiconductor device
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | 반도체 장치 및 이의 제조 방법 | KOREA | KIPRIS |
| Registered | SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME | UNITED STATES |