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Detail
Registered Adhesive film for Electric device and method of fabricating a semiconductor package using the same
이미지 확대
Adhesive film for Electric device and method of fabricating a semiconductor package using the same
- Inventors
- Keonsoo Jang, Eom Yong Sung, Choi Kwang-Seong, Moon Seok-Hwan, Bae Hyun-Cheol
- Application No.
- 10-2018-0053710 (2018.05.10) KIPRIS
- Publication No.
- 10-2019-0084844 (2019.07.17)
- Registration No.
- 10-2541924-0000 (2023.06.05)
- Country
- KOREA
- Project Code
- 17PB4100, Eco-friendly Interconnection Paste and Process with Laser Bonding for Flexible LED Module, Eom Yong Sung
- Abstract
- 접착 필름 및 이를 이용한 반도체 패키지의 제조 방법을 개시한다. 이 접착 필름은, 히드록실기를 포함하는 열가소성 수지; 열경화성 수지; 및 무수물을 포함한다.
- KSP Keywords
- Electric device, Semiconductor package
- Family
| Status | Patent | Country | KIPRIS |
|---|---|---|---|
| Registered | Adhesive film for Electric device and method of fabricating a semiconductor package using the same | KOREA | KIPRIS |