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Registered LASER BONDING METHOD

Inventors
Choi Kwang-Seong, Eom Yong Sung, Keonsoo Jang, Moon Seok-Hwan, Bae Hyun-Cheol
Application No.
16/555060 (2019.08.29)
Publication No.
US2020/0075535 A1 (2020.03.05)
Registration No.
11107790 (2021.08.31)
Country
UNITED STATES
Project Code
18PB3900, Development of Equipment and Thermal Process Technology for Flexible Display and Devices, Choi Kwang-Seong
KSP Keywords
Laser bonding
Family
 
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Status Patent Country KIPRIS
Registered 레이저 접합 방법 KOREA KIPRIS