Registered
온도 효과 역전 현상을 이용하는 네트워크 온 칩
- Inventors
-
한규승, 이재진, 이석호
- Application No.
- 2019-0005445 (2019.01.15)
- Publication No.
- 10-2020-0088744 (2020.07.23)
- Registration No.
- 2607349 (2023.11.23)
- Country
- KOREA
- Project Code
-
18HB2600, Development of ultra-low power intelligent edge SoC technology based on lightweight RISC-V processor,
Jae-Jin Lee
- KSP Keywords
- Temperature effect inversion(TEI), network on chip(NoC), temperature effect