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Registered 온도 효과 역전 현상을 이용하는 반도체 장치

Inventors
이석호, 이재진, 한규승
Application No.
2019-0005442 (2019.01.15)
Publication No.
10-2020-0088743 (2020.07.23)
Registration No.
2591678 (2023.10.16)
Country
KOREA
Project Code
18HB2600, Development of ultra-low power intelligent edge SoC technology based on lightweight RISC-V processor, Jae-Jin Lee
KSP Keywords
Temperature effect inversion(TEI), semiconductor device, temperature effect