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Registered SEMICONDUCTOR DEVICE USING TEMPERATURE EFFECT INVERSION

Inventors
Sukho Lee, Han Kyuseung, Jae-Jin Lee
Application No.
2019-0005442 (2019.01.15)
Publication No.
10-2020-0088743 (2020.07.23)
Registration No.
2591678 (2023.10.16)
Country
KOREA
Project Code
18HB2600, Development of ultra-low power intelligent edge SoC technology based on lightweight RISC-V processor, Jae-Jin Lee
KSP Keywords
Temperature effect inversion(TEI), semiconductor device, temperature effect