Registered
HEAT DISSIPATING SUBSTRATE COMPRISING DIAMOND AND SEMICONDUCTOR INTEGRATED DEVICE INCLUDING THE SAME
- Inventors
-
Hyung Seok Lee, Bae Sung-Bum
- Application No.
- 17/518511 (2021.11.03)
- Publication No.
- US2022/0189845 A1 (2022.06.16)
- Registration No.
- 12191227 (2025.01.07)
- Country
- UNITED STATES
- Project Code
-
20PB6400, Development of Diamond package technology with high heat dissipatiob for GaN Power devices,
Hyung Seok Lee
- KSP Keywords
- Integrated device, Semiconductor integrated
- Family
-