Registered
마이크로파 가열 장치 및 이를 이용한 반도체 패키징 제조 방법
- Inventors
-
- Application No.
- 2023-0041523 (2023.03.29)
- Publication No.
- 10-2023-0144947 (2023.10.17)
- Registration No.
- 2782345 (2025.03.11)
- Country
- KOREA
- Project Code
-
22PB3500, Technology of conductive interconnction material and mini LED package,
Eom Yong Sung
-
, ,
-
22JB1700, Development of electroplating materials for semiconductor high-density modules,
Eom Yong Sung
-
22JB1900, Development of multi-functional core materials of transfer and bonding process for micro LEDs,
Choi Kwang-Seong
-
22PB2300, Development of thin photovoltaic module over 25% efficiency based on micro solar cells for mobile applications,
Choi Kwang-Seong
- KSP Keywords
- Manufacturing method, Microwave heating, Semiconductor packaging, heating device
- Family
-