Registered
연성인쇄회로기판과 세라믹 피드스루 구조체의 고정밀 접합을 위한 광 트랜시버 및 패키지 구조체
- Inventors
-
강은규, 이종진, 김대선, 정수용, 권원배, 권상진
- Application No.
- 2022-0121569 (2022.09.26)
- Publication No.
- 10-2024-0042814 (2024.04.02)
- Registration No.
- 2813610 (2025.05.23)
- Country
- KOREA
- Project Code
-
22HK1400, Development of 800Gbps optical transceiver for intra-datacenter networks,
Jong Jin Lee
- KSP Keywords
- Circuit Board, Flexible printed circuit, Optical Transceiver, Package structure, feed-through, high-precision, printed circuit, printed circuit board(PCB)