High Speed, Optical connector, Optical interconnection, Optical interconnection module, Packaging technology, high speed optical interconnection, multi-channel
Funding Org.
한국전자통신연구원
Research Org.
한국전자통신연구원
Project Code
05ZB1300, Development of Multi-Channel Optical Connector-Based High Speed Optical Interconnection Module and Packaging Technology,
Han Sang-Pil
Abstract
1차년도 24채널 2D 광커넥터 시제품 제작 및 특성 평가 - 24채널 2D MT 페룰 시제품 제작 $cdot$ 광섬유홀 피치 정밀도: $leq$ ${pm}1.0{mu}m$ - 2D 광커넥터 연마공정 최적화 연구 $cdot$ 광커넥터 표면조도: $leq$ 5nm - 2D 광커넥터의 광학적 특성 평가 $cdot$ 삽입손실: $leq$ 1.0 dB 24채널 2D 고분자 광도파로 접속소자 구현 - 24채널 2D 고분자 광도파로 제작 $cdot$ 코어 피치 정밀도: $leq$ $pm3.0{mu}m$ - 광섬유와의 접속기술 연구 $cdot$ 광도파로-광커넥터간 결합손실: $leq$ 0.5dB - 2D 광도파로의 광학적 특성 평가 $cdot$ 도파손실 : $leq$ 0.1dB/cm 24채널 광접속모듈 시제품 제작 및 특성 평가 - 2D 반사경 제작 $cdot$ VCSEL/PD-광도파로간 결합손실 : $leq$ 1.5dB - 2D 어레이칩 패키징 기술 연구 - Eye 패턴 동작특성 시험 $cdot$ 전송속도: $geq$ 2.5Gb/s 2차년도 24채널 2D 광접속 모듈 특성시험 - 광학적 특성시험 $cdot$ 송신모듈 출력 광전력: $geq$ -5dBm $cdot$ 수신모듈 광민감도: $leq$-16dBm $cdot$ BER: $10^{-12}$ $cdot$ Skew: $leq$ 100ps - 환경적 특성시험 $cdot$ 온도 시험 추가손실($0{sim}80^{circ}C$): $leq$ 0.5dB 24채널 2D 광접속 모듈 신뢰성 향상 기술 연구 - Stress-free 구조연구 - Metal Sealing 기술 연구 - 장기 신뢰성 향상기술 연구
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