02MB3700, Research on pyroelectric infrared array sensor using MEMS technology,
Byoung Gon Yu
Abstract
가. 최종 연구 목표 종래의 냉각 장치가 부착된 적외선 센서의 여러 가지 단점을 극복하고 생산비용이 절감, 전력 소모의 최소화, 소형화, 경량화가 가능하여 휴대용 전자기기에 부착될 수 있는 집적화된 적외선 센서 어레이 소자 기술의 확보. 나. 연구 수행 범위 - 적외선 센서에 적용되는 새로운 강유전체 박막 - 열전달를 최소화할 수 있는 새로운 적외선 소자 구조 - 적외선 FPA 공정의 최적화 다. 연구의 내용 1) 적외선 센서에 적용되는 새로운 강유전체 박막 - Pyroelectric 박막의 두께: 0.3 ㎛ 이하 - Detectivity(D＊) : $10^8cmHz^{½}/W$ - 유전손실(tan δ) : 0.03 이하 - Pyroelectric coefficient: 0.05 uC/cm²K - Fill Factor : 50% 이상 2) 센서의 구조 확립 - 하부전극 및 supporting layer 구조의 연구 및 확립 - 열전달을 최소화할 수 있는 새로운 소자구조 제안 - MEMS 공정 기술의 최적화 3) 재현 가능한 소자 공정 기술 개발 - 적외선 센서 공정의 집적화 기술 구현 - ROIC 공정과의 정합성 기술 제안 4) 시험 검증물의 구현 - 회로 설계 및 측정기술 확립 - 2차원 적외선 센서 어레이 pixel 수 ∼ 64 × 64 - 어레이 센서 pixel 간 Pitch ∼ 50 ㎛ - 신소재, 신 소자구조를 포함한 센서 어레이 시작품 제작
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