ETRI-Knowledge Sharing Plaform

Low Temperature(LT) High Performance Inkjet Printing Color Filters Thin Film Encapsulation White Oleds Printing Process Solution-Processed Indium Oxide Flash Lamp Annealing(FLA) On/Off Ratio Wide Color Gamut Augmented Reality(AR) Small Form Factor Carrier Concentration Annealing Effects Trench Structure Optical Sensor Optical Loss Sensor Based Quantitative Measurement Optical Properties Oxide Tfts Device Performance White Organic Light-Emitting Diodes Optical Crosstalk Indium Nitrate Oxide Film Full-Color Scattering Particles Bilayer Structure Flexible Substrate Field Of View(FOV) Low-Cost Nitrate Solutions Optical Splitter Si Substrate Solution Temperature Annealing Time Current Efficiency Encapsulation Process Zinc Hydroxide Blue Emission Electrical Performance X-Ray Photoelectron Spectroscopy (Xps) Oled Display Annealing Process Film Thickness Insertion Loss Planar Lightwave Circuit(PLC) Room-Temperature Subthreshold Swing(SS) Self-Assembled Monolayers(SAMs) X-Ray Photoemission Spectroscopy On/Off Current Ratio Oxygen Vacancies Optical And Electrical Properties High Aspect Ratio Thin Metal Layer Pixel Array Sub-Micron Organic-Inorganic Hybrid Device Characteristics Indium Zinc Oxide Single Mode Oxide Gate Dielectric Optical Design Display Module Hybrid Thin Film Mass Production Microcavity Effect First Stokes(S1) O 1s Active Devices Gate Insulator High Contrast Ratio Intermediate Electrodes In-Ga-Zn-O(IGZO) Pre-Annealing Measurement Condition Transparent Electrode Optimized Thickness Application Areas Ag Thin Film Annealing Atmosphere Bias Current Blue Color Crystallite Size Device Structure Flexible Device Full-Width At Half-Maximum(FWHM) Flexible Oled Graphene Anode High-Luminance Halide Perovskite Quantum Dots Inorganic Thin Films Low Leakage Current Low Surface Roughness Photonic Devices Photolithography Process Protection Layer Top-Emitting Organic Light-Emitting Device(TE-OLED) Transport Characteristics Transmission Electron Microscopy(TEM) Particle Control Perovskite Nanocrystals Visible Light Surface Contamination Colloidal Quantum Dot(CQD) Zinc Oxide Layer Stacked Oled Oxide Field Annealing Temperature Charge Injection Efficiency Channel Characteristics Capping Layer Creative Technology Dipole Orientation Electrical Transport Efficiency And Quality Electron Injection Emission Characteristics Enhanced Efficiency High Power Head-Mounted Highly Conductive Ionic Impurities Luminance Compensation Metal Oxide Thin Films Metal Oxide Thin Film Transistors Mixed Layer Next-Generation National Television Pl Spectrum Ultraviolet-Ozone Treatment Transistor Characteristics Quantum Yields(QYs) Solution-Processed Devices Red Light Rapid Response Rgb Color Structure Optimization Stretchable Displays Output Power Oled Devices Oxide Channel Organic Devices After Treatment Analytical Method Active Area Blue Spectrum Bridge Safety Cutoff Frequency Cost-Effective Dye-Doped Driving Voltage Encapsulation Technology Field-Effect Transistors(FETs) Flexible Display High Current Luminescence Efficiency Led Applications Light-Emitting Structure New Approach Oxide Formation Top Electrode Turn-On Voltage Temperature Distribution Threshold Voltage(Vth) Titanium Nitride QD-LED Passivation Layer Vertical Stacking State-Of-The-Art Recent Progress Scanning Electron Microscopy(S.E.M.) Zno Thin Films Optoelectronic Performance Blue Light-Emitting Change Of Refractive Index Current-Voltage Measurements Color Conversion Layer Emission Spectra Force Microscopy High-Density Irradiation Time Hole Injection Low Power Consumption Metal Thin Film Nitrogen Defects Nanoparticle Composite Organic Light-Emitting Diode Display Night Vision Post-Annealing Effect Thin Lens Virtual Reality Applications 4-Vinyl Phenol(Poly) Source/Drain Electrodes Spectrum Bandwidth Optical Reflectance Optical Components Optical Efficiency Aluminium Oxide Blue Oleds Augmented Cognition Coated Film Decomposition Temperature Direct Patterning Fast Response Time Growth And Transfer Horizontal Dipole High Efficiency Impedance Spectra Large Grain Mixed Halide Perovskite Metal Interface Oxide Precursors Practical Use Plasma-Enhanced Atomic Layer Deposition Polymer Chain Prediction Model Time Of Flight Secondary Ion Mass Spectrometry(ToF-SIMS) Vivo Experiments Refractive Index Sensor Structural Design Wireless Sensor Wide Fov Solution-Processed Tfts Spin Speed Rod-Shaped Stacked Structure Sub-Pixel Organic Diodes Organic Photovoltaics(OPVs) Optimal Thickness Optical Simulation Atomic Force Microscope(AFM) And Virtual Reality Aqueous Solution Aluminum Oxide Charge Transport Cavity Length Color Change Digital Camera Display Applications Electroluminescence Spectrum Emissive Layer(EL) Interface Engineering Light Emitting Devices Pixel Circuit Patterning Technique Patterned Graphene Three-Wavelength Technology Status Thermally Evaporated Tin Layer Smooth Surface Sheet Resistance Reverse Bias Silicon Substrate High Mobility Wide Field Spin-Coated Optoelectronic Devices Oled Technology Ambient Conditions Carrier Mobility Distributed Bragg Reflector Deep Blue Display Technology Electrical Characteristics Flexible Electronics Graphene Films Hole Trap High-Resolution Displays High Order Higher Efficiency Precursor Film Large-Area Graphene Manufacturing Cost Light-Emitting Materials Low Voltage Metal Electrode Microcavity Structure Metal Anode Post-Annealed Production Operations Uv-Ozone Tandem Structure U-Bend Waveguide Technical Feasibility Thick Aluminum Red Phosphorescent Red Emission Quantum Dot Display Trap Levels Viewing Angle Spectral Bandwidth Safety Management Self-Luminescence 000 Rpm Current State Wide Range Zinc Oxide Nanoparticle Organic Interfaces Optical Structure Organic Thin-Film Transistors Atmospheric Conditions Anode Materials Aperture Ratio Contact Region Cmos Process Color Coordinates Crack Propagation Electrical Devices Fine Metal Mask Film Formation Future Prospects Gen 2 Hole Transporting Layer Igzo Thin Film High Color Purity High Frequency(HF) Igzo Tfts Improved Performance I-Line Intense Pulsed Light Irradiation Metal-Oxygen Level Production Measuring Equipment Manufacturing Processes Non-Destructive Plasma-Enhanced Chemical Vapor Deposition (Pecvd) Polymer Layer Thin Metal Films 1550 Nm Transport Behavior Perovskite Nanoparticles Various Substrates Sol-Gel Reaction Operational Stability Water Vapor Transmission Rate Recording Electrodes 3 V Zno Films