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Type Year Title Cited Download
Conference
2020 Development of Data Acquisition System for Collecting and Processing Data   Youngjae Lee   International Conference on Consumer Electronics (ICCE) 2020, pp.1-2 6
Conference
2020 Design of SW Framework for Trustworthy AI-Data Commons   Sunhwan Lim   International Conference on Information and Communication Technology Convergence (ICTC) 2020, pp.1883-1885 7
Conference
2020 An Organizational Structure for the Thing-User Community Formation   Seong-Soon Joo   International Conference on Information and Communication Technology Convergence (ICTC) 2020, pp.1124-1127 0
Conference
2020 Development of Unit Robot Skill based Task Recipe for Task Planning   Hyonyoung Han   International Conference on Information and Communication Technology Convergence (ICTC) 2020, pp.1720-1722 2
Conference
2020 A Comparative Study on the Maritime Object Detection Performance of Deep Learning Models   SungWon Moon   International Conference on Information and Communication Technology Convergence (ICTC) 2020, pp.1155-1157 5
Conference
2013 A Novel Super-Junction Trench Gate MOSFET Fabricated Using High Aspect-Ratio Trench Etching and Boron Lateral Diffusion Technologies   S.G. Kim   International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2013, pp.233-236 5
Conference
2013 An Audio-Haptic Feedbacks for Enhancing User Experience in Mobile Devices   Jeong-Mook Lim   International Conference on Consumer Electronics (ICCE) 2013, pp.49-50 6
Conference
2013 An Efficient Lookup Mechanism for Hierarchical ID Mapping System   Byeong-ok Kwak   International Conference on Information and Communication Technology Convergence (ICTC) 2013, pp.981-983 0
Conference
2013 Analysis of Electric Energy Consumption Patterns: A Case Study of a Real Life Office Building   Jinsoo Han   International Conference on Mechanical, Industrial, and Manufacturing Technologies (MIMT) 2013, pp.158-162 2
Conference
2013 Analysis of Forward Characteristics in AlGan/GaN SBD with Schottky Contact Lying on Mesa Edge   Youngrak Park   International Conference on Solid State Devices and Materials (SSDM) 2013, pp.144-145