Subjects :
Surface mounting
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
|
Journal
|
2020 |
Epoxy-based Interconnection Materials and Process Technology Trends for Semiconductor Packaging
Eom Yong Sung 전자통신동향분석, v.35, no.4, pp.1-10 |
|
원문
|
|
Conference
|
2015 |
A Novel Packaging Method of Fully Passive Optical Alignment for Multi-Chennel Optical Interconnection Module
Lim Kwon-Seob Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) 2015, pp.156-158 |
0 |
원문
|
|
Conference
|
2013 |
Design and Verification of SMT MMIC Package using a 20 GHz LNA, a 40 GHz LNA and a 40GHz Digital Attenuator
Ju In Kwon Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2013, pp.255-258 |
2 |
원문
|
|
Journal
|
2008 |
Low Loss DC to 50 GHz LTCC SMT Package for Millimeter Wave MMICs
Ju In Kwon Microwave and Optical Technology Letters, v.50, no.1, pp.24-29 |
0 |
원문
|
|
Conference
|
2007 |
Novel Vertical Transition Using a Trough Line, a Slab Line and Shielded Multilayer Coplanar Waveguides for 50 GHz LTCC Hermetic SMT MMIC Package
Ju In Kwon European Micorwave Integrated Circuits Conference (EuMIC) 2007, pp.563-566 |
3 |
원문
|
특허 검색결과
| Status |
Year |
Patent Name |
Country |
Family Pat. |
KIPRIS |
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연구보고서 검색결과
| Type |
Year |
Research Project |
Primary Investigator |
Download |
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