|
Conference
|
2023 |
2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain for PIM Heterogeneous Integration Platform
Sujin Park International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-3 |
0 |
원문
|
|
Conference
|
2019 |
Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration
Choi Kwang-Seong International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 |
3 |
원문
|
|
Conference
|
2019 |
Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2019, pp.197-203 |
24 |
원문
|
|
Journal
|
2013 |
Fine‐Pitch Solder on Pad Process for Microbump Interconnection
Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 |
25 |
원문
|