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Journal
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2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
2 |
원문
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Conference
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2012 |
3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process
Bae Hyun-Cheol Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 |
1 |
원문
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Journal
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2005 |
Study of Transport and Dielectric of Resistive Memory States in NiO Thin Film
김민규 Japanese Journal of Applied Physics, v.44, no.42, pp.L1301-L1303 |
37 |
원문
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