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Journal
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2013 |
Preliminary Works of Contact via Formation of LCD Backplanes Using Silver Printing
Yong Suk Yang ETRI Journal, v.35, no.4, pp.571-577 |
8 |
원문
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Conference
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2002 |
The effect of via size on fine pitch and high density solder bumps for wafer level packaging
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 |
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원문
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Conference
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2001 |
Effects of O/sub 2//C/sub 2/F/sub 6/ plasma descum with RF cleaning on via formation in MCM-D substrate using photosensitive BCB
Ju Chull Won Electronic Components and Technology Conference (ECTC) 2001, pp.1-3 |
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원문
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