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Conference
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2025 |
A Novel Photo-Patternable Epoxy Flux Material for A New Horizon in Fine Pitch Flip-Chip Interconnections
Gwang-Mun Choi European Microelectronics and Packaging Conference (EMPC) 2025, pp.1-5 |
0 |
원문
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Conference
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2022 |
Interconnection Reliability of Mini LEDs for Display Applications
Kye Inseok Electronic Components and Technology Conference (ECTC) 2022, pp.1184-20 |
0 |
원문
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Journal
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2021 |
Thermochemical Mechanism of the Epoxy-Glutamic Acid Reaction with Sn-3.0 Ag-0.5 Cu Solder Powder for Electrical Joining
Gwang-Mun Choi Polymers, v.13, no.6, pp.1-14 |
14 |
원문
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Conference
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2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
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Conference
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2017 |
Development of Stacking Process for 3D TSV (Through Silicon Via) Structure using Laser
Choi Kwang-Seong International Microelectronics Assembly and Packaging Society (IMAPS) 2017, pp.1-5 |
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원문
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Conference
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2015 |
Characterization of Hybrid Underfill for Low-Temperature Process Applicable to Flexible Substrate
Jihye Son Electronics Packaging Technology Conference (EPTC) 2015, pp.1-4 |
0 |
원문
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