Subjects : Advanced packaging
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2025 | 2.5D/3D Stacked Optical Chiplet Enabling Tera bit/s-Scale Optical Interfaces: Advanced Packaging and Material Innovations Lee Jyung Chan International Conference on the Physics of Non-Crystalline Solids (PNCS) 2025, pp.62-62 | ||
| Journal | 2024 | Development Trends in Advanced Packaging Technology of Global Foundry Big Three Hwangsoo Chun 전자통신동향분석, v.39, no.4, pp.98-106 | 원문 | |
| Journal | 2018 | Laser-Assisted Bonding Technology for Interconnections of Multidimensional Heterogeneous Devices Choi Kwang-Seong 전자통신동향분석, v.33, no.6, pp.50-57 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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