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Journal
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2016 |
Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate
Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 |
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원문
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Journal
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2015 |
Development of Copper Electro-Plating Technology on a Screen-Printed Conductive Pattern with Copper Paste
Eom Yong Sung 한국마이크로전자 및 패키징학회지, v.22, no.1, pp.51-54 |
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원문
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Conference
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2013 |
Epoxy Copper Paste as an Isotropic Conductive Adhesive
Eom Yong Sung International Conference on Electronics Packaging (ICEP) 2013, pp.507-510 |
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