Subject

Subjects : Si interposer

  • Articles (3)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2015 Characterization of 3D Stacked High Resistivity Si Interposers with Polymer TSV Liners for 3D RF Module   Choi Kwang-Seong  Electronic Components and Technology Conference (ECTC) 2015, pp.928-933 4 원문
Conference 2012 Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps   Choi Kwang-Seong  Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 1 원문
Conference 2010 3D SiP Module using TSV and Novel Solder Bump Maker   Bae Hyun-Cheol  Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 5 원문
특허 검색결과
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연구보고서 검색결과
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