Subject

Subjects : FEM simulation

  • Articles (5)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2019 Wafer-Level-Based Open-Circuit Sensitivity Model from Theoretical ALEM and Empirical OSCM Parameters for a Capacitive MEMS Acoustic Sensor   Jaewoo Lee  Sensors, v.19, no.3, pp.1-14 2 원문
Conference 2016 Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs   Choi Kwang-Seong  Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 2 원문
Journal 2015 A Concave-Patterned TiN/PECVD-Si3N4 /TiN Diaphragm MEMS Acoustic Sensor Based on a Polyimide Sacrificial Layer   Jaewoo Lee  Journal of Micromechanics and Microengineering, v.25, no.12, pp.1-13 8 원문
Conference 2006 Analysis of Crosstalk and Impedance Matching for 60 GHz Band Electro-Absorption Duplexer (EAD) Module   Choi Kwang-Seong  International Topical Meeting on Microwave Photonics (MWP) 2006, pp.1-4 1 원문
Conference 2005 Guaranteed Passive Coupled-Microstrip Interconnect Modeling Using Finite Element Method   Se-Ho You  IEEE MTT-S International Microwave Symposium 2005, pp.1431-1434 2 원문
특허 검색결과
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연구보고서 검색결과
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