Subjects :
Differential scanning calorimetry (dsc)
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
|
Journal
|
2025 |
Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP)
Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 |
0 |
원문
|
|
Conference
|
2014 |
Flip-Chip Bonding Processes with Low Volume SoP Technology
Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 |
0 |
원문
|
|
Journal
|
2013 |
The Observation of Electrical Hysteric Behavior in Synthesized V2O5 Nanoplates by Recrystallization
김창희 Journal of Nanomaterials, v.2013, pp.1-8 |
4 |
원문
|
|
Conference
|
2012 |
Fine-Pitch, Low-Volume SoP(Solder-on-Pad) Process
Ho-Eun Bae Electronics Packaging Technology Conference (EPTC) 2012, pp.723-727 |
2 |
원문
|
|
Journal
|
2010 |
Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder
백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 |
32 |
원문
|
|
Journal
|
2009 |
A New Poly(thienylenevinylene) Derivative with High Mobility and Oxidative Stability for Organic Thin‐Film Transistors and Solar Cells
임보규 Advanced Materials, v.21, no.27, pp.2808-2814 |
124 |
원문
|
|
Journal
|
2009 |
Self-Organized Interconnection Process Using Solderable ACA (Anisotropic Conductive Adhesive)
임병승 Materials Transactions, v.50, no.7, pp.1684-1689 |
7 |
원문
|
|
Journal
|
2008 |
Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film
Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 |
64 |
원문
|
특허 검색결과
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연구보고서 검색결과
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