Subjects :
Bonding material
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Conference
|
2022 |
Mini LED array transferred onto a flexible substrate using Simultaneous Transfer and Bonding (SITRAB) process and Anisotropic Solder Film (ASF)
Jiho Joo Electronic Components and Technology Conference (ECTC) 2022, pp.619-624 |
2 |
원문
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|
Conference
|
2021 |
Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material
Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 |
5 |
원문
|
|
Conference
|
2020 |
Thermal analysis of power module using high heat dissipation substrate and bonding material
Donghwan Kim 대한전자공학회 학술 대회 (하계) 2020, pp.151-154 |
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|
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Journal
|
2015 |
Epoxy Solder Paste and Its Applications
문종태 대한용접·접합학회지, v.33, no.3, pp.32-39 |
|
원문
|
|
Conference
|
2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
|
|
Conference
|
2013 |
Novel Interconnection Technology for Flex-on-Glass (FOG) Applications
Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 |
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특허 검색결과
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Family Pat. |
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연구보고서 검색결과
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