Subjects :
Coefficient of thermal expansion
논문 검색결과
| Type |
Year |
Title |
Cited |
Download |
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Conference
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2023 |
Analysis of Heat Dissipation Characteristics of Power Modules with Different Top Metal and Bottom Metal Thicknesses of Insulated Metal Substrate
박성효 대한전자공학회 학술 대회 (하계) 2023, pp.116-119 |
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Journal
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2023 |
Thermal Design of High Power Semiconductor Using Insulated Metal Substrate
Jeong Bongmin 마이크로전자 및 패키징학회지, v.30, no.1, pp.63-70 |
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원문
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Conference
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2022 |
Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate
Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
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Conference
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2021 |
Low Fluorine Colorless Polyimide Substrate for Flexible OLED Display
Kim Yong Hae The Electrochemical Society (ECS) Meeting 2021, pp.1-19 |
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원문
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Journal
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2021 |
Thermal analysis of 22.9-kV crosslinked polyethylene cable joint based on partial discharge using fiber Bragg grating sensors
Hyunjin Kim Optical Engineering, v.60, no.3, pp.1-8 |
11 |
원문
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Journal
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2021 |
A Light-Driven Vibrotactile Actuator with a Polymer Bimorph Film for Localized Haptic Rendering
Inwook Hwang ACS Applied Materials & Interfaces, v.13, no.5, pp.6597-6605 |
22 |
원문
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Conference
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2017 |
Silica Filler Content in NCP and its Effects on the Reliability of 3D TSV Multi-Stack under Thermal Shock Test
주니어 Electronics Packaging Technology Conference (EPTC) 2017, pp.1-8 |
8 |
원문
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특허 검색결과
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Year |
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Family Pat. |
KIPRIS |
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연구보고서 검색결과
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